File information: | |
File name: | AVR347 AVR 350 Service Manual.pdf [preview AVR347 AVR 350 Service Manual] |
Size: | 19497 kB |
Extension: | |
Mfg: | DENON |
Model: | AVR347 AVR 350 Service Manual 🔎 |
Original: | AVR347 AVR 350 Service Manual 🔎 |
Descr: | DENON Audio AVR-347 AVR347 AVR 350 Service Manual.pdf |
Group: | Electronics > Consumer electronics > Audio |
Uploaded: | 02-12-2019 |
User: | Anonymous |
Multipart: | No multipart |
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Decompress result: | OK | |
Extracted files: | 1 | |
File name AVR347 AVR 350 Service Manual.pdf harman/kardon AVR 347/230, AVR 350/230 Service Manual harman/kardon Service Manual AVR 347/230 AVR 350/230 7 x 55W 7.1 CHANNEL A/V RECEIVERS CONTENTS ESD WARNING...2 AVR 350 DISASSEMBLY...13 BASIC SPECIFICATIONS...3 AVR 350 EXPLODED VIEW AND PARTS...14 TROUBLESHOOTING GUIDE...4 ELECTRICAL PARTS LIST...15 PROCESSOR RESET...4 SEMICONDUCTOR PINOUTS...74 AVR 347 PACKAGE LIST AND PARTS...5 PCB DRAWINGS...124 AVR 347 DISASSEMBLY...6 BLOCK DIAGRAM...133 AVR 347 DISASSEMBLY PROCEDURE...7 WIRING DIAGRAM...134 AVR347 EXPLODED VIEW AND PARTS...11 AMP BIAS ADJUSTMENT...135 AVR350 PACKAGE LIST AND PARTS...12 SCHEMATIC DIAGRAMS...136 Released EU2008 harman/kardon, Inc. Rev 0, 07/2008 250 Crossways Park Dr. Woodbury, New York, 11797 Page 1 of 145 harman/kardon AVR 347/230, AVR 350/230 Service Manual Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build-up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some |
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